What is an SOIC package?

The SOIC is a surface mount integrated circuit package. The standard form is a flat rectangular body, with leads extending from two sides. The leads are formed in a gull wing shape to allow solid footing during assembly to a PCB. The pad can be soldered to the PCB to dissipate heat.

Is SOP and SOIC the same?

SOP (JEITA/EIAJ) These are sometimes called “wide SOIC”, as opposed to the narrower JEDEC MS-012, but they in turn are narrower than the JEDEC MS-013, which may also be called “wide SOIC”.

What are the different IC chip sizes?

Through-hole packages

What are the types of IC packaging?

The Common IC Packaging Types

• DIP (Double In-line Package)
• SOP/SOIC/SO (Small Outline Package)
• QFP (Quad Flat Package)
• QFN/LCC (Quad Flat Non-leaded Package)
• BGA (Ball Grid Array Package)
• CSP (Chip Scale Package)

What is the difference between SOIC and TSSOP?

The SOIC is taller (1.75mm vs. 1.2mm) which is enough to make a difference in a thin product. The lead pitch is much closer (almost half) on the TSSOP- 0.65mm vs. 1.27mm, so for crude manufacturing processes the SOIC might well be preferred.

What is the difference between SSOP and TSSOP?

The main difference between TSSOP and SSOP is the width of the pads or pins, the pitch between the two remains . 65 mm the width of the pads varies from .

How do I choose the right IC?

Be knowledgeable and experienced when it comes to selecting the right IC modules to build your project. Possess the required hardware skills such as simulation. Be thorough with designing the layout of your Integrated Circuit and assembling it as per your block diagram.

How do you read an IC number?

Read the serial number from the top side of the IC. The top side of the IC is facing up when the chip is standing on its pins. You may require a magnifying glass while reading the IC serial information.

What is VLSI packaging?

Very large scale integration (VLSI) circuit design deals with the assembly of these components to provide specific func- tionality. Packaging is the process that connects the assembled integrated circuit with the rest of the device. This has also lead to a development in packaging technologies.

What is the difference between Tssop and SSOP?

SSOP package having leads in two side of periphery and having lead pitch less than 1.0mm, said package named Shrink Small Outline Package. TSSOP package having an encapsulant width less than 300mils covering entire package, having total height less than 1.2mm, said package named Thin Shrink Small Outline Package.

What is the difference between pdpdip and SOIC and SOP?

PDIP = .1″ pin spacing SOIC = .05″ TSSOP = .025″ Their “SOP” is a wide SOIC; same pin spacing but a wider package. As well, this particular TSSOP also has a wider package than a typical TSSOP.

What is the difference between a dip and a SOIC?

The SOIC package is shorter and narrower than DIP, the side-to-side pitch being 6 mm for an SOIC-14 (from lead tip to lead tip), and the body width being 3.9 mm. These dimensions differ depending on the SOIC in question, and there are several variants.

What is the difference between SPDIP and SIP?

SPDIP: This is the Shrink Plastic Dual In-Line Package. It’s essentially just a smaller PDIP. The pins have a nice .07″ pitch and have the same pros and cons as the PDIP. SIP: Say hello to the Single In-Line Package! This package is just like the PDIP, although it only has one row of leads.

What is SOIC (Small outline integrated circuit)?

SOIC: This is the Small Outline Integrated Circuit. It is about as big as the PDIP and has a very similar pin configuration to the SDIP package. It is also much thinner than the DIP options.